What is your overall impression of the software? John Hollenberg wrote: Unfortunately, I must say that the PC version has many bugs left.
Jan 31, 2018 - Colorthink Pro 3 0 3 Serial Ports And Parallel. Windows Server 2003, Microsoft Windows XP, and Microsoft Windows 2000 operating systems. Our website provides a free download of ColorThink Pro 3.0.3 for Mac. The most popular version among the application users is 3.0. The program relates to Design & Photo Tools. Our built-in antivirus checked this Mac download and rated it as 100% safe. The latest version of the application is supported on Mac OS X 10.4.0 or later.
Of about 60 that I reported 6 months ago perhaps 15-20 have been fixed. Beta4 has a bug (on my system anyway) not present in Beta3 or earlier releases which results in 'Graph List' not working for a color list in a color worksheet. Note that this bug could be system specific-I have a Matrox P750 dualhead graphics card that might be part of the problem, don't know. Danielsan wrote: what is your overall impression of the software? I can't really give an informed impression at this point. On my system the software is too slow and buggy.
In fairness I should mention that my graphics card, a Matrox P750, is somehow not up to the 3D task. It is slow as molasses. On my father's system (he has a $50 graphics card) I installed the beta just to check and the 3D stuff just flew. Also, I find I still run into errors, wrong results, screens not being refreshed properly so that the wrong numbers are displayed far too often to try to evaluate the software. It just isn't stable enough yet.
For me, it is still very much a beta. The disappointment is that most of the bugs remain 6 months after they were reported.
I am toying with the idea of posting my bug list, not to upset anyone, but to see if others have these bugs too or if they are specific to my system. I would do post it. AT least you might be able to figure out whether the video card is aprt of the problem.
Thanks for your info. I dont think I want to drop $400 on a program that is still buggy and without documentation. I'll wait and look for alternatives. John Hollenberg wrote: danielsan wrote: what is your overall impression of the software? I can't really give an informed impression at this point. On my system the software is too slow and buggy.
In fairness I should mention that my graphics card, a Matrox P750, is somehow not up to the 3D task. It is slow as molasses. On my father's system (he has a $50 graphics card) I installed the beta just to check and the 3D stuff just flew. Also, I find I still run into errors, wrong results, screens not being refreshed properly so that the wrong numbers are displayed far too often to try to evaluate the software.
It just isn't stable enough yet. For me, it is still very much a beta. The disappointment is that most of the bugs remain 6 months after they were reported.
I am toying with the idea of posting my bug list, not to upset anyone, but to see if others have these bugs too or if they are specific to my system. What are your needs? That way I can compare them to what ColorshopX offers and let you know if it would fit some of those areas. It's not perfect, but for most of what I feel I need, it works, and does those things well. If you want the user manual, I can email it to you, it's not completely detailed, but will give a good idea of what it can do. You can also try the demo for something like 14 days.
For the $99 it might do what you need. There's another set of utilities that do similar things, but I can't remember what they are right now.
And I would also be interested in the bug list. I d/l ed ColorshopX before (at your suggestion! ) to help figure out the DMax of various papers. Obviously the 14 day trial is long over. If you can email the user manual that would be great.
At this point, I was mostly interested in a better way to evaluate paper profiles. The graphing functions and other tools to evaluate the profiles(i.e. Gamut volume, neutrality, etc). Essentially, the graphing, profile inspector, and colorsmarts guide in Color Think are of most interest at this point. I still need to improve my color management knowledge a lot to make the most of these tools. Exul wrote: What are your needs? That way I can compare them to what ColorshopX offers and let you know if it would fit some of those areas.
It's not perfect, but for most of what I feel I need, it works, and does those things well. If you want the user manual, I can email it to you, it's not completely detailed, but will give a good idea of what it can do. You can also try the demo for something like 14 days. For the $99 it might do what you need. There's another set of utilities that do similar things, but I can't remember what they are right now. And I would also be interested in the bug list.
SuperSpeed USB logo Type Production history Designed November 2008 Manufacturer USB 3.0 Promoter Group (, and ) Superseded Superseded by (July 2013) General specifications Width 12 mm (A plug), 8 mm (B plug), 12.2 mm (Micro-A & Micro-B plugs) Height 4.5 mm (A plug), 10.44 mm (B plug), 1.8 mm (Micro-A & Micro-B plugs) Pins 9 Electrical Max. Current 900 mA Data Data signal Yes Bitrate 5 Gbit/s (625 MB/s) USB 3.0 is the third major version of the (USB) standard for interfacing computers and electronic devices. Among other improvements, USB 3.0 adds the new transfer rate referred to as SuperSpeed USB (SS) that can transfer data at up to 5 (625 ), which is about 10 times faster than the standard. It is recommended that manufacturers distinguish USB 3.0 connectors from their USB 2.0 counterparts by using blue color for the Standard-A receptacles and plugs, and by the initials SS., released in July 2013, is the successor standard that replaces the USB 3.0 standard.
USB 3.1 preserves the existing SuperSpeed transfer rate, giving it the new label USB 3.1 Gen 1, while defining a new SuperSpeed+ transfer mode, called USB 3.1 Gen 2 which can transfer data at up to 10 Gbit/s over the existing USB-type-A and connectors (1250 MB/s, twice the rate of USB 3.0)., released in September 2017, replaces the USB 3.1 standard. It preserves existing USB 3.1 SuperSpeed and SuperSpeed+ data modes and introduces two new SuperSpeed+ transfer modes over the connector using two-lane operation, with data rates of 10 and 20 Gbit/s (1250 and 2500 MB/s). Contents. Overview The USB 3.0 specification is similar to, but with many improvements and an alternative implementation. Earlier USB concepts such as endpoints and the four transfer types (bulk, control, and interrupt) are preserved but the protocol and electrical interface are different. The specification defines a physically separate channel to carry USB 3.0 traffic. Front view of a Standard-A USB 3.0 connector, showing its front row of four pins for the USB 1.x/2.0 backward compatibility, and a second row of five pins for the new USB 3.0 connectivity.
The plastic insert is in the USB 3.0 standard blue color known as Pantone 300C. In USB 3.0, dual-bus architecture is used to allow both USB 2.0 (Full Speed, Low Speed, or High Speed) and USB 3.0 (SuperSpeed) operations to take place simultaneously, thus providing. The structural topology is the same, consisting of a tiered star topology with a root hub at level 0 and hubs at lower levels to provide bus connectivity to devices. Data transfer and synchronization The SuperSpeed transaction is initiated by a host request, followed by a response from the device. The device either accepts the request or rejects it; if accepted, the device sends data or accepts data from the host. If the endpoint is halted, the device responds with a STALL handshake. If there is lack of buffer space or data, it responds with a Not Ready (NRDY) signal to tell the host that it is not able to process the request.
When the device is ready, sends an Endpoint Ready (ERDY) to the host which then reschedules the transaction. The use of and the limited amount of packets, combined with asynchronous notifications, enables links that are not actively passing packets to be put into reduced power states, which allows better power management. Data encoding The 'SuperSpeed' bus provides for a transfer mode at a nominal rate of 5.0 Gbit/s, in addition to the three existing transfer modes. Accounting for the encoding overhead, the raw data throughput is 4 Gbit/s, and the specification considers it reasonable to achieve 3.2 Gbit/s (400 MB/s) or more in practice.
All data is sent as a stream of eight-bit (one-byte) segments that are scrambled and converted into 10-bit symbols via; this helps the receiver to decode correctly even in the presence of (EMI). Scrambling is implemented using a free-running (LFSR). The LFSR is reset whenever a COM symbol is sent or received. Unlike previous standards, the USB 3.0 standard does not specify a maximum cable length, requiring only that all cables meet an electrical specification: for copper cabling with 26 wires, the maximum practical length is 3 meters (9.8 ft). Power and charging As with earlier versions of USB, USB 3.0 provides power at 5 volts nominal. The available current for low-power (one unit load) SuperSpeed devices is 150 mA, an increase from the 100 mA defined in USB 2.0. For high-power SuperSpeed devices, the limit is six unit loads or 900 mA (4.5 ), almost twice USB 2.0's 500 mA.: section 9.2.5.1 Power Budgeting The term 'available current' can be misunderstood.
It implies that if a low power device or a USB2 device is connected to a USB3 port it can only draw 150 mA or 500 mA from that port. However, the available current for any USB device plugged into a USB3 port is 900 mA (unless it is charging port compliant) as defined by the USB3 spec. The actual current draw is determined by the device capability.
The Vbus, pin 1, and Ground, pin 4, are the same for USB 1, 2, or 3. A USB2 with 2 USB2 connectors needing a total of 800 mA will draw full power from a single USB3 port. A USB2 phone will probably charge faster since 900 mA is 'available' to it.
USB 3.0 ports may implement other USB specifications for increased power, including the for up to 1.5 A or 7.5 W, or, in the case of USB 3.1, the for charging the host device up to 100 W. Availability. A USB 3.0 four-port hub, using a chipset The USB 3.0 Promoter Group announced on 17 November 2008 that the specification of version 3.0 had been completed and had made the transition to the (USB-IF), the managing body of USB specifications. This move effectively opened the specification to hardware developers for implementation in future products. The first USB 3.0 consumer products were announced and shipped by in November 2009, while the first certified USB 3.0 consumer products were announced on 5 January 2010, at the Las Vegas (CES), including two motherboards. Manufacturers of USB 3.0 host controllers include, but are not limited to, Etron,. As of November 2010, Renesas and Fresco Logic have passed USB-IF certification.
Motherboards for 's processors have been seen with Asmedia and Etron host controllers as well. On 28 October 2010, released the 17 3D featuring a Renesas USB 3.0 host controller several months before some of their competitors. Worked with Renesas to add its USB 3.0 implementation into its chipsets for its 2011 platforms. At CES2011, unveiled a laptop called ' X500' that included USB 3.0 and, and released a new series of laptops that would include USB 3.0. As of April 2011, the and series were available with USB 3.0 ports, and, as of May 2012, the laptop series were as well; yet the USB root hosts failed to work at SuperSpeed under Windows 8. On 11 June 2012, announced new and with USB 3.0. Adding to existing equipment.
Side connectors on a laptop computer. Left to right: USB 3.0 host, connector, USB 2.0 host.
Note the additional pins on the top side of the USB 3.0 port. In laptop computers that lack USB 3.0 ports but have an slot, USB 3.0 ports can be added by using an ExpressCard-to-USB 3.0 adapter.
Although the ExpressCard port itself is powered from a 3.3 V line, the connector also has a USB 2.0 port available to it (some express cards actually use the USB 2.0 interface rather than the true express card port). However, this USB 2.0 port is only capable of supplying the power for one USB 3.0 port. Where multiple ports are provided on the express card, additional power will need to be provided. Additional power for multiple ports on a laptop PC may be derived in the following ways:.
Some ExpressCard-to-USB 3.0 adapters may connect by a cable to an additional USB 2.0 port on the computer, which supplies additional power. The ExpressCard may have a socket for an external power supply. If the external device has an appropriate connector, it can be powered by an.
USB 3.0 port provided by an ExpressCard-to-USB 3.0 adapter may be connected to a separately-powered USB 3.0 hub, with external devices connected to that USB 3.0 hub. On the motherboards of desktop PCs which have (PCIe) slots (or the older standard), USB 3.0 support can be added as a PCI Express. In addition to an empty PCIe slot on the motherboard, many 'PCI Express to USB 3.0' expansion cards must be connected to a power supply such as a adapter or external power supply, in order to power many USB 3.0 devices such as mobile phones, or external hard drives that have no power source other than USB; as of 2011, this is often used to supply two to four USB 3.0 ports with the full 0.9 A (4.5 W) of power that each USB 3.0 port is capable of (while also transmitting data), whereas the PCI Express slot itself cannot supply the required amount of power. If faster connections to storage devices are the reason to consider USB 3.0, an alternative is to use, possibly by adding an inexpensive expansion slot bracket that provides an eSATAp port; some external hard disk drives provide both USB (2.0 or 3.0) and eSATAp interfaces. To ensure compatibility between motherboards and peripherals, all USB-certified devices must be approved by the (USB-IF).
At least one complete end-to-end test system for USB 3.0 designers is available on the market. Adoption The USB Promoter Group announced the release of USB 3.0 on November 2008. On 5 January 2010, USB-IF announced the first two certified USB 3.0 motherboards, one by Asus and one by Gigabyte. Previous announcements included Gigabyte's October 2009 list of seven USB 3.0 motherboards, and an ASUS motherboard that was cancelled before production.
Commercial controllers were expected to enter into volume production in the first quarter of 2010. On 14 September 2009, announced a USB 3.0 external hard drive.
On 4 January 2010, announced a small portable HDD bundled with an additional USB 3.0, targeted for laptops (or desktops with ExpressCard slot addition) at the CES in Las Vegas Nevada. The contains support for USB 3.0 since version 2.6.31, which was released in September 2009. Supports USB 3.0 since version 8.2, which was released in February 2011.
Was the first Microsoft operating system to offer built in support for USB 3.0. In support was not included with the initial release of the operating system.
However, drivers that enable support for Windows 7 are available through websites of hardware manufacturers. Released its first with integrated USB 3.0 ports in 2012 with the release of the chipset. Some industry analysts have claimed that Intel was slow to integrate USB 3.0 into the chipset, thus slowing mainstream adoption.
These delays may be due to problems in the manufacturing process, a focus to advance the platform, a wait to mature all the 3.0 connections standards (USB 3.0, ) before developing a new chipset, or a tactic by Intel to favor its new interface. Announced laptops with USB 3.0 ports on 11 June 2012, nearly four years after USB 3.0 was finalized. Began supporting USB 3.0 with its in 2011. Announced support of USB 3.0 with its -based platform intended for handheld devices.
Issues Speed and compatibility Various early USB 3.0 implementations widely used the / µD72020x family of host controllers, which are known to require a firmware update to function properly with some devices. A factor affecting the speed of USB storage devices (more evident with USB 3.0 devices, but also noticeable with USB 2.0 ones) is that the (BOT) protocol drivers are generally slower than the protocol (UASP) drivers. On some old (2009–2010) -based motherboards, the built-in USB 3.0 chipsets are connected by default via a 2.5 lane of the, which then did not provide full PCI Express 2.0 speed (5 GT/s), so it did not provide enough bandwidth even for a single USB 3.0 port. Early versions of such boards (e.g. The P55A-UD4 or P55A-UD6) have a manual switch (in BIOS) that can connect the USB 3.0 chip to the processor (instead of the PCH), which did provide full-speed PCI Express 2.0 connectivity even then, but this meant using fewer PCI Express 2.0 lanes for the graphics card. However, newer boards (e.g.
Gigabyte P55A-UD7 or the Asus P7P55D-E Premium) used a technique (in the case of those boards provided by a PEX8608 or PEX8613 PCI Express switch) that combines two PCI Express 2.5 GT/s lanes into a single PCI Express 5 GT/s lane (among other features), thus obtaining the necessary bandwidth from the PCH. Radio frequency interference USB 3.0 devices and cables may with wireless devices operating in the 2.4 GHz ISM band.
This may result in a drop in throughput or complete loss of response with and devices. Various strategies can be applied to resolve the problem, ranging from simple solutions such as increasing the distance of USB 3.0 devices from Wi-Fi routers and Bluetooth devices, to applying additional shielding around internal computer components. There were some devices (for example Vivo Xplay 3S) which were promised to come with USB 3.0, however, ultimately didn't ship with USB 3.0, because of manufacturers' inability to resolve the electromagnetic interference caused by the USB 3.0. Connectors.
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USB 3.0 Standard-A receptacle (top, in the blue color ' 300C'), Standard-B plug (middle), and Micro-B plug (bottom) A USB 3.0 Standard-A receptacle accepts either a USB 3.0 Standard-A plug or a USB 2.0 Standard-A plug. Conversely, it is possible to plug a USB 3.0 Standard-A plug into a USB 2.0 Standard-A receptacle. This is a principle of backward compatibility. The Standard-A is used for connecting to a computer port, at the host side. A USB 3.0 Standard-B receptacle accepts either a USB 3.0 Standard-B plug or a USB 2.0 Standard-B plug. Backward compatibility applies to connecting a USB 2.0 Standard-B plug into a USB 3.0 Standard-B receptacle. However, it is not possible to plug a USB 3.0 Standard-B plug into a USB 2.0 Standard-B receptacle, due to a physically larger connector.
The Standard-B is used at the device side. Since USB 2.0 and USB 3.0 ports may coexist on the same machine and they look similar, the USB 3.0 specification recommends that the Standard-A USB 3.0 receptacle have a blue insert ( 300C color). The same color-coding applies to the USB 3.0 Standard-A plug.: sections 3.1.1.1 and 5.3.1.3 USB 3.0 also introduced a new Micro-B cable plug, which consists of a standard USB 1.x/2.0 Micro-B cable plug, with an additional 5-pin plug 'stacked' inside it. That way, the USB 3.0 Micro-B host connector preserved its backward compatibility with the USB 1.x/2.0 Micro-B cable plugs. However, it is not possible to plug a USB 3.0 Micro-B plug into a USB 2.0 Micro-B receptacle, due to a physically larger connector. To be perfectly clear, you can run a device with a USB3 Micro-B socket on a USB2 Micro-B cable at USB2 speeds.
USB 3.0 Standard-A plug (top) and receptacle (bottom), with annotated pins The connector has the same physical configuration as its predecessor but with five more pins. The VBUS, D−, D+, and GND pins are required for USB 2.0 communication.
The additional USB 3.0 pins are two differential pairs and one ground (GNDDRAIN). The two additional differential pairs are for SuperSpeed data transfer; they are used for full duplex SuperSpeed signaling. The GNDDRAIN pin is for drain wire termination and to control EMI and maintain signal integrity. USB 3.0 connector pinouts Pin Color Signal name Description A connector B connector Shell N/A Shield Metal housing 1 Red VBUS Power 2 White D− USB 2.0 differential pair 3 Green D+ 4 Black GND Ground for power return 5 Blue StdASSRX− StdBSSTX− SuperSpeed receiver differential pair 6 Yellow StdASSRX+ StdBSSTX+ 7 N/A GNDDRAIN Ground for signal return 8 Purple StdASSTX− StdBSSRX− SuperSpeed transmitter differential pair 9 Orange StdASSTX+ StdBSSRX+ The USB 3.0 Powered-B connector has two additional pins for power and ground supplied to the device.
10 N/A DPWR Power provided to device (Powered-B only) 11 DGND Ground for DPWR return (Powered-B only) Backward compatibility. USB Micro-B USB 2.0 vs USB Micro-B SuperSpeed (USB 3.0) USB 3.0 and USB 2.0 (or earlier) Type-A plugs and receptacles are designed to interoperate.
USB 3.0 Type-B receptacles, such as those found on peripheral devices, are larger than in USB 2.0 (or earlier versions), and accept both the larger USB 3.0 Type-B plug and the smaller USB 2.0 (or earlier) Type-B plug. USB 3.0 Type B plugs are larger than USB 2.0 (or earlier) Type-B plugs; therefore, USB 3.0 Type-B plugs cannot be inserted into USB 2.0 (or earlier) Type-B receptacles. Micro USB 3.0 (Micro-B) plug and receptacle are intended primarily for small portable devices such as smartphones, digital cameras and GPS devices.
The Micro USB 3.0 receptacle is backward compatible with the Micro USB 2.0 plug. A receptacle for, which is an eSATA/USB combo, is designed to accept USB Type-A plugs from USB 2.0 (or earlier), so it also accepts USB 3.0 Type-A plugs.
USB 3.1 In January 2013 the USB group announced plans to update USB 3.0 to 10 Gbit/s (1.25 GB/s). The group ended up creating a new USB specification, USB 3.1, which was released on 31 July 2013, replacing the USB 3.0 standard. The USB 3.1 specification takes over the existing USB 3.0's SuperSpeed USB transfer rate, also referred to as USB 3.1 Gen 1, and introduces a faster transfer rate called SuperSpeed USB 10 Gbps, referred to as USB 3.1 Gen 2, putting it on par with a single first-generation channel. The new mode's logo features a caption stylized as SUPERSPEED+. The USB 3.1 Gen 2 standard increases the maximum to 10 Gbit/s (1.25 GB/s), double that of SuperSpeed USB, and reduces line encoding overhead to just 3% by changing the to.
The first USB 3.1 Gen 2 implementation demonstrated real-world transfer speeds of 7.2 Gbit/s. The USB 3.1 standard is backward compatible with USB 3.0 and USB 2.0. It defines the following transfer modes:.
USB 3.1 Gen 1 - SuperSpeed, 5 Gbit/s (0.625 GB/s) data signaling rate over 1 lane using 8b/10b encoding, the same as USB 3.0. USB 3.1 Gen 2 - SuperSpeed+, new 10 Gbit/s (1.25 GB/s) data rate over 1 lane using 128b/132b encoding.
USB 3.2 On 25 July 2017, a press release from the USB 3.0 Promoter Group detailed a pending update to the USB Type-C specification, defining the doubling of bandwidth for existing USB-C cables. Under the USB 3.2 specification, existing SuperSpeed certified USB-C 3.1 Gen 1 cables will be able to operate at 10 Gbit/s (up from 5 Gbit/s), and SuperSpeed+ certified USB-C 3.1 Gen 2 cables will be able to operate at 20 Gbit/s (up from 10 Gbit/s).
The increase in bandwidth is a result of multi-lane operation over existing wires that were intended for flip-flop capabilities of the USB-C connector. The USB 3.2 standard is backward compatible with USB 3.1/3.0 and USB 2.0. It defines the following transfer modes:. USB 3.2 Gen 1×1 - SuperSpeed, 5 Gbit/s (0.625 GB/s) data signaling rate over 1 lane using 8b/10b encoding, the same as USB 3.1 Gen 1 and USB 3.0. USB 3.2 Gen 1×2 - SuperSpeed+, new 10 Gbit/s (1.25 GB/s) data rate over 2 lanes using 8b/10b encoding. USB 3.2 Gen 2×1 - SuperSpeed+, 10 Gbit/s (1.25 GB/s) data rate over 1 lane using 128b/132b encoding, the same as USB 3.1 Gen 2.
USB 3.2 Gen 2×2 - SuperSpeed+, new 20 Gbit/s (2.5 GB/s) data rate over 2 lanes using 128b/132b encoding. In May 2018, demonstrated the first USB 3.2 Gen 2x2 connection, where a Windows PC was connected to a storage device, reaching a speed of 1.6 GB/s average. USB 3.2 is supported with the default Windows 10 USB drivers and in Linux Kernel 4.18.
See also.